GCOM and BECS developed new process to solve all the problems of wafer back grinding process such as edge crack, chipping, dust residue, and tilt and shift of dies when back grinding of bumping wafer.
Since 1990, Selling-Ware Company is a professional provider of materials and equipment in semiconductor, optoelectronics and panel industry. Acting products are South Korea, Japan, the United States, Germany, Singapore, Malaysia, China's well-known brands.
33 years of experience accumulation, Selling-Ware Company is well familiar with the market and the trend of technology, and can highly grasp new equipment and new materials, such that we become a reliable and long-term partner of well-known technology companies.
Headquartered in Tai Yuan Hi-tech Industrial Park, Hsinchu County, Taiwan and set branch offices in Taichung, Kaohsiung, Kunshan, Suzhou, Shenzhen, Chengdu, Xi'an, Wuhan, Jinjiang, Beijing, Wuxi, we provide customers better local services, and enhance customer competitiveness.
