BOC to PCB-based packaging substrates, which can provide power for the chip connection, protection, support, cooling, assembly and other effects, to achieve multi-pin technology, reduce the volume of packages to improve the conductivity and heat dissipation, high density Or multi-chip module of the goal.
Since 1990, Selling-Ware Company is a professional provider of materials and equipment in semiconductor, optoelectronics and panel industry. Acting products are South Korea, Japan, the United States, Germany, Singapore, Malaysia, China's well-known brands.
33 years of experience accumulation, Selling-Ware Company is well familiar with the market and the trend of technology, and can highly grasp new equipment and new materials, such that we become a reliable and long-term partner of well-known technology companies.
Headquartered in Tai Yuan Hi-tech Industrial Park, Hsinchu County, Taiwan and set branch offices in Taichung, Kaohsiung, Kunshan, Suzhou, Shenzhen, Chengdu, Xi'an, Wuhan, Jinjiang, Beijing, Wuxi, we provide customers better local services, and enhance customer competitiveness.
