Product Information
Specifications
Products Description：
When bonding during process, it applies pressure and temperature to remove tiny void in adhesive and increases steady stiffness and adhesion by controlling void elimination
Wafer Lamination,Die Bonding TC Bonding(Thermo compressing bonding)
Dispensing / Printing / Potting,Via Filling
Capillary underfilling / No flow underfilling,Reflow
Features
Temperature uniformity ±3%
Temperature control accuracy ± 0.1℃
Pressure: Max. 2.0MPa (20 kg/cm^2)
1st and 2nd pressure safety valves
Digital Recording and Network application
Temperature control and Multistep cure by control panel
Parameter management by barcode
LAN network and CIM PIM hard disk data storage
IN/OUT Automatic indication on LCD monitor
Excellent temperature control with superior temperature homogeneity
Easy PC control program
Easy to drive machine and manage data by its own software
Sample protection by overheating prevention system
Door open when power failure
Acquired safety certificate of pressure vessel