Products
High-quality semiconductor materials and equipment for diverse applications
Found 24 products
REPLACEABLE PLASTIC TIP
Model: RDTC-XXX、ASM-SCP-XXX(ROUND TIP)、RT-SCP-XXX(ASM)、ASM-SCP-XXX-XXX(SQUARE/RECTANGULAR TIP)
Used in flip chip processes; features replaceable plastic nozzle tips. Pick up the solder balls from the equipment's embossed mold and place them into the recessed pockets. Use color coding for easy identification of collet sizes.
Rubber tip
Model: RRN-XXX-XXX-1、RRN2-XXX-XXX-1、RRTHN-XXX-XXX-1、NHTR-XXX、RR-XXX-XXX-SB
Description 1: Able to withstand up to 120℃. Suitable for epoxy Die-Attached and Pick N Place process. Description 2: Temperature withstand up to 300℃and intermittent exposures t0 450℃. Description 3: Square & Rectangular Rubber Tip for Picking-Up Along the Edges of Solder Bump Die (For Flip Chip process). CUSTOM MADE SIZE IS ALSO AVAILABLE. PLEASE CONTACT US FOR YOUR REQUIREMENT. Description 4: Multiple Holes Cross-groove Hi-Temp Rubber Tip For 2-3 Mils thin Die. CUSTOM MADE SIZE IS ALSO AVAILABLE. PLEASE CONTACT US FOR YOUR REQUIREMENT. Description 5: Able to withstand up to 120℃. Suitable for epoxy Die-Attached and Pick N Place process.
Burn-in-Board
Model: The design for Aehr、Ando、 Jec 、 SSE system
Burn-in is the process of stressing and exercising electrical devices to ensure optimum performance. This process forces defective semiconductor devices to fail before they are incorporated into assemblies where they can cause reliability problems in the end product.
EddyCus® ResMapper
Model: NA
The EddyCus® ResMapper is a fully automated chip imaging device (fully automated model) with an automated chip cassette handling system for full-area characterization of chip substrates or coatings to ensure process reliability and quality assurance in the semiconductor industry. The system is equipped with two non-contact eddy current sensors operating in transfer mode. This allows for highly detailed visualization of the uniformity of the substrate material or conductive coating. This device is typically used for: • Resistivity 0.1 – 100 mOhm-cm, • Board resistivity ranging from 0.0001 – 100,000 ohms/square, • Thin film metal layer thickness ranging from 2 nm to 1 mm, • Total thickness variation ranging from 300 – 1,000 µm and bow pitch ± 1 mm.
Electric lightweight waist support
Model: S、M、L、XL、XXL
This patented vacuum-sealed lumbar support features a patented vacuum-shaped inner liner that provides strong back support. The adjustable support board conforms to individual curves, customizing the lumbar spine for a comfortable and pressure-free fit. It's comfortable to wear whether sitting, standing, or lying down.
Dispensing Nozzle
Model: SS-WDN-XX(For ESEC 2008)、UN-CGN-XXX-XXX(For ASM 889&ESEC 2008 HS)、PCN-CAM-DNN-XXX-XXX
Applied with Jet Dispensing fluid glue (such as Epoxy…etc) in hi-power-chip Die-Bonding process.
Platinum Tip
Model: SE-10-ASM-339-80°-P、SE-05P、SE-22-P、SE-18-3P、SE-27-KAIJO-780-P-1
Able to withstand up to 1,800℃. Good current density for excellent conductivity.
Needle
Model: EN-18-0.7-15-XXX、EN-18-0.7-30-XXX
Description 1: To push Die out from 100%SAWTHROUGH Wafer Tape. Suitable for Die size (Above 40X40 MILS). To reduce Microcrack Die problem. Description 2: To eliminate back Die Microcrack Problem.
Hi-Temperature Plastic Tip
Model: NF2-NM2-XXX(SHINKAWA/FOTON)、NF4-NM2-XXX(FOTON/TOSOK) NEC-NM2-XXX、H2-NM2-XXX、E1-NM2-XXX-XXX-1(ESEC) E2-NM2-XXX-XXX-(ESEC 2007/2008)
For T092, SOT23 and other Discrete process invplving heat above 400℃. For Discrete RF Power