Brands

Distributing world-class brands from Japan, Korea, Europe, and the U.S.

Found 35 brands

R-SEMICON

Product Name：Rubber Nozzle, Plastic Nozzle, Cup-type Nozzle, Ejector Pin, Custom Nozzle, Spanker Tool, Four-side Suction Nozzle (Non-contact)

Main Products：

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ESA

Product Name：Burn-in test board, reliability aging board

Main Products：

•Burn-in-Board

MKE

Product Name: Encapsulated Gold Wire, Advanced Encapsulated Gold and Silver Wire, Encapsulated Copper Wire

Main Products：

•Gold Bonding Wire、Advan Au-Ag Alloy Bonding Wire、Copper Bonding Wire

HDS

Product Name：Lead frame, IC substrate, COF substrate

Main Products：

MIT

Product Name: Fully Automated Wafer Scanning Acoustic Tester

Main Products：

SK materials performace

Product Name: LMC (Liquid Molding Compound), MUF (Molded Underfill), TIM & Lid Adhesive (Thermal Interface Material & Lid Adhesive)

LASERSSEL

Product Name：Laser reflow soldering (also known as laser reflow), 2D probing system / 2D measurement system, welding machine, bonding machine, die bonder, or wire bonder.

DYFLOWS

Product Name: Matching Fixtures, Customizable, High Compatibility

NEXENSOR

Product Name: