Products
High-quality semiconductor materials and equipment for diverse applications
Found 23 products
Fully Automated Wafer Scanning Acoustic Tester - PAC (Advanced Package)
Model: 請留言洽詢
▪ Fully Automatic SAT Suite ▪ Multi-probe ▪ Sensor Frequency: 25-200MHz ▪ Scanning Area: 300x200 (mm) ▪ Dimensions: 3200X2000X2150(mm)
Fully Automated Wafer Scanning Acoustic Tester-W (Wafer)
Model: 請留言洽詢
▪ Fully Automated Wafer Scanning Acoustic Tomography (SAT) ▪ Multi-probe head ▪ Transducer frequency: 50~250MHz ▪ Scanning Area: 300×300mm ▪ Dimensions: 1750×2200×2000mm
REPLACEABLE PLASTIC TIP
Model: RDTC-XXX、ASM-SCP-XXX(ROUND TIP)、RT-SCP-XXX(ASM)、ASM-SCP-XXX-XXX(SQUARE/RECTANGULAR TIP)
Used in flip chip processes; features replaceable plastic nozzle tips. Pick up the solder balls from the equipment's embossed mold and place them into the recessed pockets. Use color coding for easy identification of collet sizes.
Rubber tip
Model: RRN-XXX-XXX-1、RRN2-XXX-XXX-1、RRTHN-XXX-XXX-1、NHTR-XXX、RR-XXX-XXX-SB
All-new rubber tip design and custom sizes New rubber tip design, P-type a. New porous design, suitable for thin wafers with thickness less than 2 mils b. Able to withstand temperatures up to 220°C New rubber tip design, W-shaped New design adopting flip chips a. Suitable for thin wafer applications with a thickness of 1 mil or more. b. Helps resolve issues with rubber head deformation and loosening. c. Resolve thin wafer warpage issues. Popular small rubber tip - Eliminate mold surface scratch issues - Suitable for small chip size applications For example: cup-shaped LEDs and in-cavity packaging.
Dispensing Nozzle
Model: SS-WDN-XX(For ESEC 2008)、UN-CGN-XXX-XXX(For ASM 889&ESEC 2008 HS)、PCN-CAM-DNN-XXX-XXX
Applied with Jet Dispensing fluid glue (such as Epoxy…etc) in hi-power-chip Die-Bonding process.
Hi-Temperature Plastic Tip
Model: NF2-NM2-XXX(SHINKAWA/FOTON)、NF4-NM2-XXX(FOTON/TOSOK) NEC-NM2-XXX、H2-NM2-XXX、E1-NM2-XXX-XXX-1(ESEC) E2-NM2-XXX-XXX-(ESEC 2007/2008)
For T092, SOT23 and other Discrete process invplving heat above 400℃. For Discrete RF Power
Needle
Model: EN-18-0.7-15-XXX、EN-18-0.7-30-XXX
Description 1: To push Die out from 100%SAWTHROUGH Wafer Tape. Suitable for Die size (Above 40X40 MILS). To reduce Microcrack Die problem. Description 2: To eliminate back Die Microcrack Problem.
Platinum Tip
Model: SE-10-ASM-339-80°-P、SE-05P、SE-22-P、SE-18-3P、SE-27-KAIJO-780-P-1
Able to withstand up to 1,800℃. Good current density for excellent conductivity.
Groove Hi-Temp Rubber Tip
Model: 我們提供許多設計，請與矽菱連繫，並提供您的設備。
Suitable for stack die application. Able to withstand up to 260℃. Hardness：80 Shore