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INNOXSemiconductor materials

Coverlay、3Layer CCL、Bonding Sheet、Stiffener

Model: MA series、MC&MD series、BS series、MS&SA series

Coverlay、3Layer CCL、Bonding Sheet、Stiffener

Product Information

Product NameCoverlay、3Layer CCL、Bonding Sheet、Stiffener
BrandINNOX
Product ModelMA series、MC&MD series、BS series、MS&SA series
Sales Contactsw@sellingware.com.tw
Contact Sales

Specifications

Based on long experience in developing semiconductor materials, INNOX has developed FPC materials and successfully commercialized them as products like coverlay, FCCL, carrier film, bonding sheet and support board. INNOX has the complete INNOFLEX lineup that covers all sorts of FPC material. INNOX has constructed mass production systems standing on its own unique technologies in manufacturing FPC materials.
INNOFLEX will meet your needs for both reliable products and satisfactory service.