Product Information
Product NameNeedle
BrandR-SEMICON
Product ModelEN-18-0.7-15-XXX、EN-18-0.7-30-XXX
Sales Contactsw@sellingware.com.tw
Specifications
Description 1: To push Die out from 100%SAWTHROUGH Wafer Tape.
Suitable for Die size (Above 40X40 MILS). To reduce
Microcrack Die problem.
Description 2: To eliminate back Die Microcrack Problem.