Back to List
Selling-WareSemiconductor materials

Backgrinding tape

Model: Bump用Backgrinding tape、Thin Die用Backgrinding tape

Backgrinding tape

Product Information

Product NameBackgrinding tape
BrandSelling-Ware
Product ModelBump用Backgrinding tape、Thin Die用Backgrinding tape
Sales Contactsw@sellingware.com.tw
Contact Sales

Specifications

Backgrinding tape for thin dies

  • Dust-free anti-static type

  • Excellent TTV

  • High modulus type

Back Grinding Tape for Bumps

  • Excellent gap filling

  • Residue-free and anti-static type

INNOX-BGT

Back to List