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R-SEMICONSemiconductor materials

Dispensing Nozzle

Model: SS-WDN-XX(For ESEC 2008)、UN-CGN-XXX-XXX(For ASM 889&ESEC 2008 HS)、PCN-CAM-DNN-XXX-XXX

Dispensing Nozzle

Product Information

Product NameDispensing Nozzle
BrandR-SEMICON
Product ModelSS-WDN-XX(For ESEC 2008)、UN-CGN-XXX-XXX(For ASM 889&ESEC 2008 HS)、PCN-CAM-DNN-XXX-XXX
Sales Contactsw@sellingware.com.tw
Contact Sales

Specifications

Applied with Jet Dispensing fluid glue (such as Epoxy…etc) in hi-power-chip Die-Bonding process.

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